本发明公开了一种新型真空镀膜前离子清洗工艺，包括以下步骤：1、超声波清洗等离子基体表面杂质，装炉；2、在真空涂层设备内进行弧光增强氩离子轰击以清除基体表面杂质，采用电弧离子镀作为离化源，提供的电子流密度可达10⁺¹⁹/m³，同时其对面的柱状镀膜阴极在此过程转换为阳极，将高密度的电子流引向通过被清洗工件区域，将Ar原子离化，Ar+流作为对工件的离子清洗源使用；3、进入真空镀膜工艺步骤。本申请所述工艺既可以提供高密度的离子流清洗工件，保证工件各个角度得到充分清洗；又可以在使用较低偏压的情况下，防止过高金属离子流对 精密工件的过度轰击作用，损坏工件。

The present invention discloses a novel ion cleaning process before vacuum coating, comprising the following steps: 1. Ultrasonic cleaning of impurities on the surface of the plasma substrate, furnace loading; 2. Arc enhanced argon ion bombardment is carried out in the vacuum coating equipment to remove impurities on the substrate surface. Arc ion plating is used as the ionization source, providing an electron flow density of 10⁺¹⁹/m³. At the same time, the columnar coating cathode opposite it is converted into an anode during this process, directing the high-density electron flow towards the area of the cleaned workpiece, ionizing Ar atoms, and using Ar+ flow as the ion cleaning source for the workpiece; 3. Enter the vacuum coating process step. The process described in this application can provide high-density ion flow cleaning of workpieces, ensuring that all angles of the workpieces are fully cleaned; It can also prevent excessive bombardment of precision workpieces by excessive metal ion currents when using lower bias voltages, which can damage the workpieces.